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GLOBAL ELECTROMAGNETIC COMPATIBILITY (EMC) SHIELDING MARKET (2011 – 2016) Publication Date: Jan-2012 Format: PDF Pages: 142 Publisher: MarketsandMarkets Table of Contents EMC design consideration is becoming an indispensable part of product design. The rise of 3G, WiFi, and other features in mobile phones and similar enhancements in product design have served as key drivers for EMI shielding solutions. For example, in the automotive sector, the increasing adoption of navigation systems and wireless based infotainment systems are opening new revenue opportunities for EMI shielding solutions. More...

Brand Enhancement by Electronics in Packaging 2012-2022 Price: $3,995.00 (€3,148.63) ($4,794.00 (€3,778.36) Including VAT at 20%) Publication Date: Aug-2011 Format: Electronic Copy Pages: 310 Publisher: IDTechEx Table of Contents IDTechEx's new report "Brand Enhancement by Electronics in Packaging 2012-022" reveals the global demand for electronic smart packaging devices is currently at a tipping point and will grow rapidly from $0.03 billion in 2012 to $1.7 billion in 2022. The electronic packaging (e-packaging) market will remain primarily in consumer packaged goods CPG reaching 35 billion units that have electronic functionality in 2022. More…

Power Fab Database 2011 Price Single User $3,890.00 Single Site $4,890.00 Multi Site $5,790.00 Exhaustive database of 340+ worldwide power electronics players Publisher: Yole Développement Publication Date : February 2011 Our power fab database is a unique tool providing a complete overview of all power electronics manufacturers in the world. We included exhaustive information about worldwide manufacturers, including Chinese and Eastern European’s, with production type, status and capacity. In an Excel format including stats & graphs, Yole Développement’s database allows a complete customization of market and technology analysis. This database is a unique tool for business & marketing managers, institutions & investors and system manufacturers of the power electronics community. Key features: The power fab database provides for the 340+ entries information’s on: • Company and mother company • Fab details (name - address – country – area – phone/Fax – Website – Region - Area) • Fab type (Front-end, back-end) • Clean room details (size, class, construction and equipment cost and year) • Process technology (Bipolar, BICMOS, BCD, CMOS) • Maximum voltage • Substrate material (Si, SiC, Sapphire, GaAs, GaN, SOI) • Company contact (name – position – e-mail – phone) • Type of devices (MOSFET, IGBT, Thyristor/SCR/GTO, BJT, Diodes, Power IC, IPM, Power modules, Other FET) • Wafer characteristics (FZ/CZ, geometry, size, active layer) • Production capacity in wafers per month Get the real picture of today Power electronics manufacturing… Data presented are the most up-to-date information from Yole Développement power electronics team collected through a large amount of contacts, publications and exhibitions we have access to. More than 340 players of power electronics identified worldwide, with statistics sheets, graphs and pivot table for your custom analysis! Table of Contents

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